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June 2005

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Subject:
From:
"Taheri, Kamran" <[log in to unmask]>
Reply To:
TechNet E-Mail Forum <[log in to unmask]>, Taheri, Kamran
Date:
Wed, 8 Jun 2005 15:37:47 -0500
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Ben,
 
        Have you looked inside of your oven for little green monsters that might be doing this:)?  Have you attached TCs to both sides of these pads to verify the thermal difference?  It looks like that the pad design is reducing your placement accuracy tolerance.   




-----Original Message-----
From: TechNet [mailto:[log in to unmask]]On Behalf Of Gumpert, Ben
Sent: Wednesday, June 08, 2005 1:10 PM
To: [log in to unmask]
Subject: Re: [TN] mystery tombstone cause


Bev,

Yes, the direction of the tombstones on a specific board are constant
relative to that board, and are irrespective of board orientation
through the oven.

Ben

-----Original Message-----
From: TechNet [mailto:[log in to unmask]] On Behalf Of Bev Christian
Sent: Wednesday, June 08, 2005 8:40 AM
To: [log in to unmask]
Subject: Re: [TN] mystery tombstone cause

Ben,
When you say lift in different directions, do you mean in reference to
the board or in reference to the axis of the oven?  For instance are you
saying that on a single board you can have tombstones only facing to the
"top" of the board, irrespective of how you put I through the oven?
Hmm, is that clear?
Bev
RIM

-----Original Message-----
From: TechNet [mailto:[log in to unmask]] On Behalf Of Gumpert, Ben
Sent: June 8, 2005 8:09 AM
To: [log in to unmask]
Subject: [TN] mystery tombstone cause

Technetters,

I have several SMT board styles which give me some trouble with 0306
capacitor tombstones, and through many attempts to reduce the number of
these defects, I have found a condition that I can not seem to attribute
a cause to. I have found that across a board, all the tombstones tend to
lift in the same direction (for components in the same orientation).

I have looked at the build process, but different board styles result in
tombstones in different directions, so I believe the cause to be board
related. I have looked at solder mask registration (misregistration
occurs in various directions), power/ground plane connections by pad
(changes from location to location), and solder bumps due to HASL
(wicked pads have similar results), and nothing has led me to a root
cause.

Any ideas???

Thanks,
Ben Gumpert




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