TECHNET Archives

June 2005

TechNet@IPC.ORG

Options: Use Monospaced Font
Show Text Part by Default
Show All Mail Headers

Message: [<< First] [< Prev] [Next >] [Last >>]
Topic: [<< First] [< Prev] [Next >] [Last >>]
Author: [<< First] [< Prev] [Next >] [Last >>]

Print Reply
Subject:
From:
bob wettermann <[log in to unmask]>
Reply To:
TechNet E-Mail Forum <[log in to unmask]>, bob wettermann <[log in to unmask]>
Date:
Thu, 2 Jun 2005 05:39:02 -0700
Content-Type:
text/plain
Parts/Attachments:
text/plain (30 lines)
Dear Ingemar:

We would recommend that :

1.  If your exposure from a commercial standpoint is high that you perform temp cycling tests as you have indicated

2. Make sure that mask off nearby components so as to not "spread" the problem around the board

3. Perform accelerated thermal shock testing using very rigorous testing variables until failure of the device or board. Epoxies will break down eventually

4. If repairing a lifted pad or land use epoxy as the replacement means and not the adhesive dry film method as the pull strength will be a limiting factor.

Regards

Bob Wettermann


Bob Wettermann

---------------------------------------------------
Technet Mail List provided as a service by IPC using LISTSERV 1.8e
To unsubscribe, send a message to [log in to unmask] with following text in
the BODY (NOT the subject field): SIGNOFF Technet
To temporarily halt or (re-start) delivery of Technet send e-mail to [log in to unmask]: SET Technet NOMAIL or (MAIL)
To receive ONE mailing per day of all the posts: send e-mail to [log in to unmask]: SET Technet Digest
Search the archives of previous posts at: http://listserv.ipc.org/archives
Please visit IPC web site http://www.ipc.org/contentpage.asp?Pageid=4.3.16 for additional information, or contact Keach Sasamori at [log in to unmask] or 847-615-7100 ext.2815
-----------------------------------------------------
PH 847-767-5745

ATOM RSS1 RSS2