Hi Steve,
Not my field directly, but while the iron is hot, I wonder how soon it will
be before everybody is pre-baking all the Plastic Encapsulated Devices,
PBGAs etc as well (didn't even mention boards) to make sure all the moisture
is out of them before Pb-Free temperatures hit them? Or am I worrying about
nothing? More energy used - groan.

Thanks by the way for your web page etc.

Regards,
Phil.
My opinion, not my company's.
-----Original Message-----
From: Stephen Gregory [mailto:[log in to unmask]]
Sent: 15 June 2005 14:42
To: [log in to unmask]
Subject: [TN] Baking PLCC-68's...


               *** WARNING ***

This mail has originated outside your organization,
either from an external partner or the Global Internet.
     Keep this in mind if you answer this message.

Just wondering, how many of you have ever baked a
PLCC-68?

We've been raising the awareness level of our stockroom
people about component moisture sensitivity, and we've
got some PLCC-68's that are on a reel and been sitting on
on our stockroom shelf for longer than 168-hours.

Well, we got another reel of the same part number (it's an
Intel i960 PLCC-68) that came to us from Avnet in a vacuum
sealed bag with a level-3 MSL label on it.

I've never baked a PLCC-68...should I bake the reeled parts
that have been sitting on the shelf?

Kind regards,

-Steve Gregory-
Senior Process Engineer
LaBarge Incorporated
Tulsa, Oklahoma
(918) 459-2285
(918) 459-2350 FAX
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