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Normally profile at 218 centigrade on the die surface of a BGA, this gives
the best flatness profile for typical eBGA constructions.
John
------------------------------------
Avanex
John Burke
Senior Manager RoHS Compliance
[log in to unmask]
40919 Encyclopedia Circle
Fremont
CA 94538
tel: 510 897 4250
fax: 510 979 0189
mobile: 510 676 6312
------------------------------------
-----Original Message-----
From: TechNet [mailto:[log in to unmask]]On Behalf Of David Tremmel
Sent: Wednesday, June 08, 2005 2:15 PM
To: [log in to unmask]
Subject: Re: [TN] Max reflow temperature/max cycles
Genny,
If it is standard 63/37 solder, the max should be around 205° Celcius to
ensure a good intermetallic bond. But I am sure the gurus can explain it
better.
Regarding the max cycles, it depends on the class of board, the components
being used.
Are you in a repair or rework environment?
David
>From: Genny Gibbard <[log in to unmask]>
>Reply-To: TechNet E-Mail Forum <[log in to unmask]>, Genny
>Gibbard <[log in to unmask]>
>To: [log in to unmask]
>Subject: [TN] Max reflow temperature/max cycles
>Date: Wed, 8 Jun 2005 15:06:14 -0600
>
>Just wondering if there is a rule of thumb most people spec for the max
>reflow temperature allowed for a SnPb reflow process. Or an IPC spec about
>this? Also, what about how many cycles you would allow at the max reflow
>temperature?
>
>Genny
>
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Technet Mail List provided as a service by IPC using LISTSERV 1.8e
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the BODY (NOT the subject field): SIGNOFF Technet
To temporarily halt or (re-start) delivery of Technet send e-mail to [log in to unmask]: SET Technet NOMAIL or (MAIL)
To receive ONE mailing per day of all the posts: send e-mail to [log in to unmask]: SET Technet Digest
Search the archives of previous posts at: http://listserv.ipc.org/archives
Please visit IPC web site http://www.ipc.org/contentpage.asp?Pageid=4.3.16 for additional information, or contact Keach Sasamori at [log in to unmask] or 847-615-7100 ext.2815
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