Hi Keith, Hi Andy, IPC-LF Listservers,

Thanks Keith,
 By-The-Way it is good to see you again.

This, to me, means that for awhile during the transition and maybe longer
the little bit of lead (<100 to 1000ppm) (.01 to .1%) or other impurities
that we are going to get naturally during processing will keep this problem
away.

One opposing interesting data point I remember is an old LF Listserve
comment from Bob Hilty in which I believe Bob noted as an aside that he saw
Tin Pest in certain components (buss bars I think) in NYC's underground
after the World Trade Center disaster. (My memory might be wrong)

Since I believe you are over in the Japan area of our world the extended
basements and service corridors might be good places to do some testing.

<CALCE has a project to investigate the issue of tin plague in soldes as
<a project for the coming school year.
<
<Regards,
<
<Andy Kostic, Fellow, Northrop Grumman, Electronic Systems>

This is good, hopefully a Master's or PhD project.

Yours in Engineering, Dave
YiEngr, MA/NY DDave

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