How about the high-tin solder ball such as 90Sn10Pb, which has a much
higher melting temperature than eutectic tin-lead? Should the reflow
temp be raised to melt the high tin ball? Or just melt the eutectic
solder paste and let the liquidous solder dissolve the high-tin ball?

Qing

-----Original Message-----
From: Leadfree [mailto:[log in to unmask]] On Behalf Of Blair K. Hogg
Sent: Tuesday, June 14, 2005 6:29 AM
To: [log in to unmask]
Subject: Re: [LF] BGA LEAD FREE IN PROCESS LEAD

Haven't done any BGAs as of yet, LF or otherwise, but from what I've
read you need to get the ball solder to liquidus during the process for
the best solder joint. Thus you may need to run at a higher temperature,
assuming the other parts on your assembly can handle it.

We've been having similar issues with what we suspect are LF parts,
having to run boards a little hotter through the process to get
sufficient wetting. 

Blair

>>> [log in to unmask] 06/14/05 04:44AM >>>
Hi , somebody have experience in assembly using BGA lead free , but in
solder process lead ?
What about the quality of the solder joint and the quality ? 

BGA lead free
Solder paste lead
thermal profile for process lead 

Thx.
FAbrizio



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