Subject: | |
From: | |
Reply To: | (Leadfree Electronics Assembly Forum) |
Date: | Mon, 6 Jun 2005 14:13:02 -0500 |
Content-Type: | text/plain |
Parts/Attachments: |
|
|
Hi Pascal, John, IPC LF Listservers,
BTW, I sympathize with John since I feel overloaded trying to read all this
LeadFree, Pb-free, stuff that is coming our way. On top of this comes the
EU and EU member states which are having their own difficulty.
Pascal, First a Question: Do you have any references (particularly www easy
links) to recent technical reports, or old, that describe what happens with
the 150C bake that alters future temperature, or mechanically created
whisker formation. BTW 150C is not an option for all of the products and
components that might use 100% tin finishes. Some might only be able to use
120C or less.
John, As an idea for search: If 150C works to reduce the formation in
certain usage environments one should be able to look to Harsh Environments
to see them once again.
Yours in Engineering, Dave
YiEngr, MA/NY DDave
-------------------------------------------------------------------------------Leadfee Mail List provided as a service by IPC using LISTSERV 1.8d
To unsubscribe, send a message to [log in to unmask] with following text in
the BODY (NOT the subject field): SIGNOFF Leadfree
To temporarily stop/(start) delivery of Leadree for vacation breaks send: SET Leadfree NOMAIL/(MAIL)
Search previous postings at: http://listserv.ipc.org/archives
Please visit IPC web site http://www.ipc.org/contentpage.asp?Pageid=4.3.16 for additional information, or contact Keach Sasamori at [log in to unmask] or 847-615-7100 ext.2815
-------------------------------------------------------------------------------
|
|
|