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June 2005

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Subject:
From:
"Howard A. Cyker" <[log in to unmask]>
Reply To:
(Leadfree Electronics Assembly Forum)
Date:
Wed, 1 Jun 2005 08:39:49 -0400
Content-Type:
text/plain
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text/plain (83 lines)
Hi Randy,

The discoloration you see is most likely caused by impurities (organic
co-deposits) present in the matte-tin outer layer.  Assuming you reflowed
these parts above the 232 deg. C. melting point of tin, these co-deposits
would migrate to the surface.  You may find that this yellowish outer
coating is easily removed either mechanically or chemically, and does not
inhibit solderability.  A cross-section comparison between a non-reflowed
part and the reflowed part should reveal if this is your root cause.
Tighter control over the tin plating process should prevent this issue.

Good Luck,

Howard A. Cyker
Senior Manufacturing Engineer
SynQor, Inc.
E-mail:  [log in to unmask]


-----Original Message-----
From: Leadfree [mailto:[log in to unmask]] On Behalf Of R Buchter
Sent: Tuesday, May 31, 2005 5:24 PM
To: [log in to unmask]
Subject: Re: [LF] PN's changing

Hello All,

We have encountered a concern with a lead free stamped part. It is
stainless
steel base metal with 1.27micrometers minimum nickel underplate and 2.54
micrometers minimum matte tin overplate. The plastic is LCP.

After reflow, the matte tin has a yellowish color.

What could this be and how can it be avoided? Is high solder temperature
causing this? Does the stainless steel have something to do with it, as
copper alloy contacts with similar platings do not appear to have this?
Is
the LCP a factor?

Thanks in advance!

Best Regards,

Randy Buchter
Product Design Manager
Ranoda Electronics

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