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June 2005

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Subject:
From:
Reuven ROKAH <[log in to unmask]>
Reply To:
(Leadfree Electronics Assembly Forum)
Date:
Wed, 1 Jun 2005 15:39:30 +0300
Content-Type:
text/plain
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text/plain (23 lines)
Hi All,

Pls inform if there is an update document / revision of the above or new
one for the soldering material of electronic assemblies and PCBs finishing.

The documents should detail the alloy and the impurities and the  maximum
levels of each one.

Regards

Reuven


e mail: [log in to unmask]

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