Subject: | |
From: | |
Reply To: | |
Date: | Thu, 16 Jun 2005 13:06:27 -0500 |
Content-Type: | text/plain |
Parts/Attachments: |
|
|
Hello All,
I will be in test during the telecon today and unable to attend. Sorry for
the late notice.
Thanks,
John Dusl
-----Original Message-----
From: EmbeddedNet [mailto:[log in to unmask]]On Behalf Of Kim Fjeldsted
Sent: Thursday, June 16, 2005 2:11 AM
To: [log in to unmask]
Subject: Re: [EM] IPC D-51 Embedded Devices Design Subcommittee
Conference Call
John,
I will be travelling. Sorry for the late notice.
D.O.K. (Kim) Fjeldsted, PhD
Vice President Sales and Marketing
Oregon Materials Technologies, Inc.
503.580.0888 Office
503.590.0866 Fax
-----Original Message-----
From: EmbeddedNet [mailto:[log in to unmask]]On Behalf Of John Perry
Sent: Monday, June 13, 2005 7:38 AM
To: [log in to unmask]
Subject: [EM] IPC D-51 Embedded Devices Design Subcommittee Conference
Call
Colleagues,
This is a reminder that the next IPC D-51 Embedded Devices Design
Subcommittee conference call will be this Thursday, June 16th at 4PM
Eastern, 1PM Pacific. The dial-in number is 1-620-584-8200 and the
passcode is 89542#
I will be posting updated material for the IPC-2316 design guide effort
Thursday morning in advance of the call. The D-51 detail page is
located at:
http://www.ipc.org/committeedetail.asp?Committee=D-51
Regards,
John Perry
Technical Program Manager
IPC
(W) 847-597-2818
(F) 1-847-615-1705
[log in to unmask]
www.ipc.org
|
|
|