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Date: | Thu, 23 Jun 2005 15:42:26 -0400 |
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Hi All
Thank you for the great input. I have incorporated these possible root
causes as a set of actions for our team to go off and investigate. We are
also considering moving towards ENIG or Imm Ag as a other alternative.
Thanks again for your help!
Karen Walters Ebner
Raytheon Electronic Combat Systems
Towson, MD 21286
410.583.4082
R Sedlak <[log in to unmask]>
Sent by: TechNet <[log in to unmask]>
06/17/2005 05:05 AM
Please respond to
TechNet E-Mail Forum <[log in to unmask]>; Please respond to
R Sedlak <[log in to unmask]>
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Subject
Re: [TN] HASL Leveling
To add one more to Mr. Asbell's impressive list...
Dirty, or tarnished Copper pads prior to HAL
Rudy Sedlak
RD Chemical Company
Franklin D Asbell <[log in to unmask]> wrote:
1. Inadequate air flow
a. Low air pressure
b. block or disrupted air knives
c. dwell time (under air pressure)
d. incorrect air setting (on or off too early/late)
2. Orientation of the panel in the HASL process.
3. Temperature of the solder
4. Contaminates in the solder
Of these, cause #1 is the most likely in my experience.
Franklin
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