I will send a pair of pictures from an Amkor paper showing optical
micrographs showing Ni corrosion and a pad with no Ni corrosion to Steve to
see if he can put up on his web site. Published studies on Black Pad issues
often show similar structures. Steve can you post the 2 photos? I will
send after this note.
Best regards,
Leo
Director of Applications Engineering
ASAT, Inc.
3755 Capital of Texas Highway, Suite 100
Austin, Texas 78704
ph 512-383-4593
fx 512-383-1590
[log in to unmask]
www.asat.com
The information contained in this electronic message is CUSTOMER/SUPPLIER
PRIVILEGED AND CONFIDENTIAL INFORMATION intended only for the use of the
individual or entity named above. If the reader of this message is not the
intended recipient, you are hereby notified that any dissemination,
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-----Original Message-----
From: [log in to unmask] [mailto:[log in to unmask]]
Sent: Monday, June 13, 2005 2:16 PM
To: [log in to unmask]; [log in to unmask]
Subject: RE: [TN] BGA Intermittent Saga, part 2
You state to look for Au cyanide etching in the eless Ni. With what
instrument or is this under a high power micro scope (1000X). Can you
describe what to look for or perhaps you can share a photo of the
artifact you are suggesting.
Victor,
-----Original Message-----
From: TechNet [mailto:[log in to unmask]] On Behalf Of Leo Higgins
Sent: Monday, June 13, 2005 1:39 PM
To: [log in to unmask]
Subject: Re: [TN] BGA Intermittent Saga, part 2
Excessive stress from pneumatic presses used to bond heat sinks to BGAs
after board level assembly has been shown to induce failure at the
solder to
BGA pad on packages that meet pre-SMT assembly quality specs in all
ways.
Subsequent analyses may show no evidence of black pad (cross sectioning
to
look for Au cyanide etching into the eless Ni, etc.).
Best regards,
Leo
Director of Applications Engineering
ASAT, Inc.
3755 Capital of Texas Highway, Suite 100
Austin, Texas 78704
ph 512-383-4593
fx 512-383-1590
[log in to unmask]
www.asat.com
The information contained in this electronic message is
CUSTOMER/SUPPLIER
PRIVILEGED AND CONFIDENTIAL INFORMATION intended only for the use of the
individual or entity named above. If the reader of this message is not
the
intended recipient, you are hereby notified that any dissemination,
distribution and copying of this communication is strictly prohibited.
If
you have received this communication in error, please immediately notify
the
sender by electronic mail. Thank you.
-----Original Message-----
From: TechNet [mailto:[log in to unmask]]On Behalf Of Jana Carraway
Sent: Monday, June 13, 2005 1:01 PM
To: [log in to unmask]
Subject: Re: [TN] BGA Intermittent Saga, part 2
Werner,
If it's black pad on the component side, how would Kerry prove or
disprove
it? Could he find the cause by using Auger or cross-section? What
would be
the appropriate tests to perform to find root cause? Should he send a
component back to the supplier for root cause analysis?
Thank you,
Jana Carraway
Jana Carraway
MSEI - Advanced Technology Group
6024 S.W. Jean Road
Lake Oswego, OR 97035
503.697.5291, ext 1180
email: [log in to unmask]
-----Original Message-----
From: TechNet [mailto:[log in to unmask]]On Behalf Of Werner Engelmaier
Sent: Monday, June 13, 2005 10:04 AM
To: [log in to unmask]
Subject: Re: [TN] BGA Intermittent Saga, part 2
Hi Kerry,
You most likely have 'Black Pad' on the componet side. That, together
with
the stess concentration from the SMD-geometry, caused a briitle
ionterfacial
overstress failure.
Regards,
Werner Engelmaier
Engelmaier Associates, L.C.
Electronic Packaging, Interconnection and Reliability Consulting
7 Jasmine Run
Ormond Beach, FL 32174 USA
Phone: 386-437-8747, Fax: 386-437-8737, Cell: 386-316-5904
E-mail: [log in to unmask], Website: www.engelmaier.com
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