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June 2005

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TechNet <[log in to unmask]>
X-To:
TechNet E-Mail Forum <[log in to unmask]>, Mumtaz Bora <[log in to unmask]>
Date:
Tue, 14 Jun 2005 16:45:54 -0700
Reply-To:
TechNet E-Mail Forum <[log in to unmask]>, Judy Brown <[log in to unmask]>
Subject:
Re: Drop Test/Dynamic Test data for Sn/3.0Ag/0.5Cu(SAC 305)
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From:
Judy Brown <[log in to unmask]>
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Check with Cookson Electronics. www.cooksonelectronics.com. 

-----Original Message-----
From: TechNet [mailto:[log in to unmask]] On Behalf Of Mumtaz Bora
Sent: Tuesday, June 14, 2005 4:35 PM
To: [log in to unmask]
Subject: [TN] Drop Test/Dynamic Test data for Sn/3.0Ag/0.5Cu(SAC 305)

Dear All,


I am looking for Dynamic Test Data for Lead free Alloy SAC 305 for
cellphone applications. I have seen some data that indicates overall
dynamic test performance in Pb Free solder (SAC 305) is lower than the
existing Pb solder.(63/37). Any references to industry data
for keypad test or phone drop test using 8-10 layer microvia boards will
be
appreciated.
Thank-you

Mumtaz

  D/ 8165 - SMT Process Quality
  Bldg. V244H
Voice  (858)-882-1967
Fax    (858)-882-3511
Page  (858)-635-1180
email: [log in to unmask]

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