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Mon, 13 Jun 2005 17:41:54 EDT |
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Hi Ioan,
Well actually, the landpattern would be the size of each of the metallization
projections; about 60 mils wide and 20 mils long times two, of course.
You would inspect those solder joints the same way you inspect the solder
joints of BGAs--you do not. I always found it curious that people want to design
things so they can be better inspected, not that they function bettter.
Remember, the J-lead/gullwing arguments?
First, the CCs would swim up--the solder has nowhere to go. Second, many of
these chips are glued anyway. Third a soldermask dam underneath the CC serves
well.
Regards,
Werner Engelmaier
Engelmaier Associates, L.C.
Electronic Packaging, Interconnection and Reliability Consulting
7 Jasmine Run
Ormond Beach, FL 32174 USA
Phone: 386-437-8747, Fax: 386-437-8737, Cell: 386-316-5904
E-mail: [log in to unmask], Website: www.engelmaier.com
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