One last chance to submit an abstract for the Flex & Chips and RFID Conference, please get your submission in as soon as possible to [log in to unmask] Papers are still being sought in the following areas:

* RFID Market Place
* Fundamentals of RFID
* RFID Application and Case Studies
* Supply Chain Management
* Tag Ticket Technology
* New RFID Techniques
* Future Trends for Radio Frequency Technology
* RFID Role with Label Printing & Automotive ID Industries
* RFID Technology and Production Advancement
* New Developments and Innovations of RFID
* CSP Standards Progress 
* Wafer Level CSP 
* CSP Solder Joint Reliability
* Flex Processing Innovations
* Flex Assembly
* Flex Market Trends 
* Non-CSP Flex Applications Tests and Reliability
* Flex HDI for CSP Applications
* CSPs in Three Dimensions
* Flex and CSP Materials
* Design for CSPs on Flex
* Flex with CSP Yields
* Flip Chip Development
* Flex and Lead Free
* Advanced Packaging 

The International Conference on Flexible Circuits, Chip Scale Packaging and Radio Frequency Identification offers presentation time slots between 30-45 minutes.  The presentation must be of a non-commercial nature, focusing on the technology rather than serving as an advertisement for a company's product.

We are also soliciting proposals from individuals interested in teaching full-day tutorials (six hours) or half-day workshops (three hours) in a class of up to 30 persons on relevant topics.  An honorarium is offered to tutorial and workshop instructors.

Companies interested in finding out why they should sponsor an event or promote their products and services in a tabletop exhibit, please contact Alexandra Curtis at 847-597-2877 or e-mail at [log in to unmask]

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