Hi Technetters,
Does anyone know of any data available that shows what safe bake times
and temperatures are if you want to deviate from those listed in
J-STD-033? From experience, we know that baking components and PWB's at
the recommended temperatures of 125 Deg. C. has a negtive impact on
solderability. I am looking for data that provides a bake time guideline
for baking at a temperature of 100 to 110 deg. C.
Also, how is the MSD handling verifiable? What methods are used so that
a person can audit the process to verify that component's Open Floor
Life is not exceeded, and that if the OFL did expire before the parts
were reflowed, the parts were baked out prior to assembly and reflow?

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