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May 2005

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Subject:
From:
Kevin Buchanan <[log in to unmask]>
Reply To:
TechNet E-Mail Forum <[log in to unmask]>, Kevin Buchanan <[log in to unmask]>
Date:
Thu, 5 May 2005 10:11:17 -0400
Content-Type:
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Hello All,

   I'm looking for some guidance.

   My understanding into the fabrication process is limited
to the following:

   Etching: For every oz. down, the feature will be etched back the same
amount. What I'm not sure about is how much additional clearance is required
between the features for the etching process.

   I hope that someone can educate me in this area, articles, books,
experience, etc..

   The information will be used for determining what the max copper weight
is that a footprint
can be placed on.

Regards,

Buck

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