Ray
I agree that such an agent is required? Does your company produce this tin bath or is it one that you purchase. If you are purchasing the bath how did you convince yourself there are no such foreign agents.
Also you mention accelerating an immersion process. An immersion process by definition is based only upon the differential voltage potential associated with the elements in question. How can you then accelerate this process without introducing some additional mechanism? If that is the case you no longer have an immersion process.
J. Lee Parker, Ph.D.
JLP Consultants LLC
804 779 3389
----- Original Message -----
From: R Sedlak<mailto:[log in to unmask]>
To: [log in to unmask]<mailto:[log in to unmask]>
Sent: Friday, May 27, 2005 7:06 PM
Subject: Re: [TN] Immersion Plating
An electroless process requires a reducing agent, an agent which donates electrons to covert the ions in solution to metal... there is no reducing agent in our immersion Tin, therefore it cannot be an electroless process....
FYI... the above is true of most electroless Tin processes offered commercially.
Rudy Sedlak
RD Chemical Company
Lee parker <[log in to unmask]<mailto:[log in to unmask]>> wrote:
Ray
I am suppressed to learn about you tin bath. Is there any data to support this is a true immersion process?
J. Lee Parker, Ph.D.
JLP Consultants LLC
804 779 3389
----- Original Message -----
From: R Sedlak
To: TechNet E-Mail Forum ; Lee parker
Sent: Friday, May 27, 2005 5:55 PM
Subject: Re: [TN] Immersion Plating
About Immersion plating... thickness is not necessarily an indicator of plating mechanism... except in the extreme thick plating.
It is quite possible to get much more than 10 microinches of plating using pure immersion plating techniques... we are very aware of this, because our immersion Tin bath gives 40+ microinches, and it is a pure immersion/galvanic plating mechanism.
My suspicion is that the faster an immersion plating bath plates, the thicker it can apparently plate up, as the plating is non-uniform at higher speeds, and you are building metal up high, while some areas are still exposed, and thus dissolving Copper, and feeding electrons to the built up areas.
I also suspect strongly that most immersion Silver plating baths are just that, immersion only.
When you get into electroless type plating, the baths become less stable, and much trickier to control.... as if I have to tell the people who have the onerous responsibility of maintaining Electroless Nickel plating baths.
Rudy Sedlak
RD Chemical Company
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