The article is good, indeed, but I think Black Pad is used way to often to cover everything we haven't understood yet.
Vladimir
Research in Motion
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-----Original Message-----
From: TechNet [mailto:[log in to unmask]]On Behalf Of Stadem, Richard
Sent: Friday, May 27, 2005 11:15 AM
To: [log in to unmask]
Subject: Re: [TN] Solderablity of ElectrolessNickel
An excellent article on the P content and its effects on solderability
is in the September 2002 copy of Global SMT and Packaging. It is titled
"The Black Pad Failure Mechanism, From Beginning to End". It was written
by a number of engineers with Cookson/Alpha Metals.
-----Original Message-----
From: TechNet [mailto:[log in to unmask]] On Behalf Of Brian Ellis
Sent: Friday, May 27, 2005 9:37 AM
To: [log in to unmask]
Subject: Re: [TN] Solderablity of ElectrolessNickel
(B. Dunn, Metallurgical Assessment of Spacecraft Parts, Materials
> and Processes)
My God, I thought I was the only one with that book on my shelves!!!
Brian
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