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Subject:	Re: Solderablity of ElectrolessNickel
From:	"Stadem, Richard" <[log in to unmask]>
Reply To:	TechNet E-Mail Forum <[log in to unmask]>, Stadem, Richard
Date:	Fri, 27 May 2005 10:14:38 -0500
Content-Type:	text/plain
Parts/Attachments:	text/plain (41 lines)

An excellent article on the P content and its effects on solderability
is in the September 2002 copy of Global SMT and Packaging. It is titled
"The Black Pad Failure Mechanism, From Beginning to End". It was written
by a number of engineers with Cookson/Alpha Metals.  

-----Original Message-----
From: TechNet [mailto:[log in to unmask]] On Behalf Of Brian Ellis
Sent: Friday, May 27, 2005 9:37 AM
To: [log in to unmask]
Subject: Re: [TN] Solderablity of ElectrolessNickel

(B. Dunn, Metallurgical Assessment of Spacecraft Parts, Materials
> and Processes)

My God, I thought I was the only one with that book on my shelves!!!

Brian

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