Hi Rich,
It may sound strange, but I'm not sure at all the content of P in the Ni-P layer will affect the solderability. You might want to take a look at recent ATOTECH papers where they claim that a higher P content (up to 13%) results in a stronger joints (I'd have to say that they used a thin layer of Pd in between e-Ni and Au, but it shouldn't "affect" the solderability to e-Ni topic).
regards,
Vladimir
Vladimir Igoshev, Ph. D.
Senior Materials Researcher
Research in Motion
451 Phillip St.
Waterloo, ON, N2L 3X2
Voice: (+1) 519-888-7465, ext. 5283
Fax: (+1) 519-886-0863
E-mail: [log in to unmask]
-----Original Message-----
From: TechNet [mailto:[log in to unmask]]On Behalf Of Richard Kraszewski
Sent: Friday, May 27, 2005 9:11 AM
To: [log in to unmask]
Subject: [TN] Solderablity of ElectrolessNickel
I'm trying to clearly confirm the level of phosphorus at which the
solderability of electroless nickel starts to be severely reduced.
Traditionally, I always thought it was 5%. I colleague of mine claims
that he's got a paper from 89' at the "Electroless Ni Conference" that
states that up to 3% is no problem. I do recall seeing an article last
year where 6 to 8% seems to be the preferred maximum .
Any thoughts on what the appropriate level should be, and/or the
mechanism of why it is it degrades solderablity would be truly
appreciated.
Rich K - KEDS
---------------------------------------------------
Technet Mail List provided as a service by IPC using LISTSERV 1.8e
To unsubscribe, send a message to [log in to unmask] with following text in
the BODY (NOT the subject field): SIGNOFF Technet
To temporarily halt or (re-start) delivery of Technet send e-mail to [log in to unmask]: SET Technet NOMAIL or (MAIL)
To receive ONE mailing per day of all the posts: send e-mail to [log in to unmask]: SET Technet Digest
Search the archives of previous posts at: http://listserv.ipc.org/archives
Please visit IPC web site http://www.ipc.org/contentpage.asp?Pageid=4.3.16 for additional information, or contact Keach Sasamori at [log in to unmask] or 847-615-7100 ext.2815
-----------------------------------------------------
---------------------------------------------------------------------
This transmission (including any attachments) may contain confidential information, privileged material (including material protected by the solicitor-client or other applicable privileges), or constitute non-public information. Any use of this information by anyone other than the intended recipient is prohibited. If you have received this transmission in error, please immediately reply to the sender and delete this information from your system. Use, dissemination, distribution, or reproduction of this transmission by unintended recipients is not authorized and may be unlawful.
---------------------------------------------------
Technet Mail List provided as a service by IPC using LISTSERV 1.8e
To unsubscribe, send a message to [log in to unmask] with following text in
the BODY (NOT the subject field): SIGNOFF Technet
To temporarily halt or (re-start) delivery of Technet send e-mail to [log in to unmask]: SET Technet NOMAIL or (MAIL)
To receive ONE mailing per day of all the posts: send e-mail to [log in to unmask]: SET Technet Digest
Search the archives of previous posts at: http://listserv.ipc.org/archives
Please visit IPC web site http://www.ipc.org/contentpage.asp?Pageid=4.3.16 for additional information, or contact Keach Sasamori at [log in to unmask] or 847-615-7100 ext.2815
-----------------------------------------------------
|
