Rich,

Electroless nickel (EN) plating is generally solderable until the phosphor
content in the plating exceeds 5-7 percent. (H. Manko, Solders and
Solderability)

However, solderability may be adversely affected in EN platings with as low
as 3.5% percent phosphor content if the plating has been subjected to heat
treating. (B. Dunn, Metallurgical Assessment of Spacecraft Parts, Materials
and Processes)

Tin-lead solder tinning of electroless nickel plated copper wire can be
accomplished successfully at +725-750F with RMA or RA flux.

Bob


-----Original Message-----
From: TechNet [mailto:[log in to unmask]] On Behalf Of Richard Kraszewski
Sent: Friday, May 27, 2005 8:11 AM
To: [log in to unmask]
Subject: [TN] Solderablity of ElectrolessNickel

I'm trying to clearly confirm the level of phosphorus at which the
solderability of electroless nickel starts to be severely reduced.

Traditionally, I always thought it was 5%. I colleague of mine claims
that he's got a paper from 89' at the "Electroless Ni Conference" that
states that up to 3% is no problem.  I do recall seeing an article last
year where  6 to 8% seems to be the preferred maximum .

Any thoughts on what the appropriate level should be, and/or the
mechanism of why it is it degrades solderablity would be truly
appreciated.

Rich K - KEDS










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