Hi,Experts in Technet:
    I'd like to ask some one familiy with package technology. Someone told me that in Flipchip BGA, the only choice for  surface finish of the substrate is ENIG. I am curious about this? What about Electronicplating-NiAu?  I think if we can control the thickness of the Gold layer, then the Gold embrittlment will not happen. What other should be care about?
    Also Any successfully application with the OSP in Flipchip-BGA?
    If the only choice for FC-BGA is ENIG, how can the package supplier control with the black pad issue?

   Thanks!

Regards!

Sunny
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