Luigi,
Not to eat into Graham's MUST sales, you might also consider sequential
electrochemical reduction analysis (SERA) as an alternative.  It is
non-destructive in nature so you don't waste components in the analysis.
ECI Technology sells SERA equipment
(http://www.ecitechnology.com/index2.cfm?contentID=79).  Dave Hillman is
the expert in this technology, but is on travel this week.  We use this
technology here to evaluate solderability of components and boards stored
for long periods of time prior to production.

Doug Pauls




             Luigi Cantagallo
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             @ETCA.ALCATEL.BE>                                          To
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             05/25/2005 04:00          [TN] Wetting balance
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Hello Technetters,

I have questions about wetting balance.
We intend to use a wetting balance not to accept/reject supplied SMD's (Our
SMD's are 1 to 5 years old) but to minimize the risk of solderability
defects in production (Low volume, SnPb technology).
So we don't apply J-STD-002D criterium but we try to find them to
corroborate wetting balance and production results.
On some tests (Wetting balance calibrated and in order, same type of flux,
same alloy) on same component lots, we have not a perfect correspondence
between wetting balance and visual inspections results in production (Vapor
phase soldering). One of the case is "Good at the solderability test/Defect
in production" and this one is the most risky.
Somebody have experience with that kind of problem?
What actions have you made ?

Thanks for answers.

Best regards,

CANTAGALLO Luigi

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