TECHNET Archives

May 2005

TechNet@IPC.ORG

Options: Use Monospaced Font
Show Text Part by Default
Show All Mail Headers

Message: [<< First] [< Prev] [Next >] [Last >>]
Topic: [<< First] [< Prev] [Next >] [Last >>]
Author: [<< First] [< Prev] [Next >] [Last >>]

Print Reply
Subject:
From:
"Ingemar Hernefjord (KC/EMW)" <[log in to unmask]>
Reply To:
TechNet E-Mail Forum <[log in to unmask]>, Ingemar Hernefjord (KC/EMW)
Date:
Wed, 25 May 2005 08:54:04 +0200
Content-Type:
text/plain
Parts/Attachments:
text/plain (85 lines)
Al,
what proffesional a presentation! You really need help?
I'm not a board specialist myself, but have seen a lot from my many years as 'monocle'. I just say: high asperity! I'll send you off line a list on 17 good papers that will lead you through the mystery of blowholes, flux contaminations, flux capping, copper barrel corrosion etc. Guess everything about PTH hole filling exist in TN's archive, but I don't have time to do searching.
We accept no such voids, not for MIL nor for COM.
IPC-600 G says nothing about voids.
Good Luck.
Ingemar Hernefjord 
Ericsson Microwave Systems

-----Original Message-----
From: TechNet [mailto:[log in to unmask]]On Behalf Of Al Onderick
Sent: den 24 maj 2005 21:44
To: [log in to unmask]
Subject: [TN] Solder Joint Anomaly


Dear Technetters,

            I now have a couple of cross sections to go along with my
xrays.



Does anyone have an idea what might cause this type of anomaly?




http://www.texas-gold.org/PCB/pages/xray/index.htm



Is this a problem or just a strange looking void ?



The board supplier is going to run the following tests



*                    Cross section the 15 pin connector area for optical
microscopy and analysis.

*                    Scanning Electron Microscopy (SEM) analysis of solder
filled and bare silver hole wall surfaces

o                  SEM will identify particulate or other 3-dimensional
bodies to be analyzed with EDS.

*                    Energy Dispersive Spectometry (EDS) analysis of
solder filled and bare silver hole wall surfaces

o                  EDS will identify the all elements relative to the
point of failure to identify possible contributors as the root cause.

*                    X-Ray Fluorescence of bare silver hole wall surfaces

o                  XRF will determine the thickness of the solder deposit
in the hole walls in the 15 pin connector area.



-Al


---------------------------------------------------
Technet Mail List provided as a service by IPC using LISTSERV 1.8e
To unsubscribe, send a message to [log in to unmask] with following text in
the BODY (NOT the subject field): SIGNOFF Technet
To temporarily halt or (re-start) delivery of Technet send e-mail to [log in to unmask]: SET Technet NOMAIL or (MAIL)
To receive ONE mailing per day of all the posts: send e-mail to [log in to unmask]: SET Technet Digest
Search the archives of previous posts at: http://listserv.ipc.org/archives
Please visit IPC web site http://www.ipc.org/contentpage.asp?Pageid=4.3.16 for additional information, or contact Keach Sasamori at [log in to unmask] or 847-615-7100 ext.2815
-----------------------------------------------------

---------------------------------------------------
Technet Mail List provided as a service by IPC using LISTSERV 1.8e
To unsubscribe, send a message to [log in to unmask] with following text in
the BODY (NOT the subject field): SIGNOFF Technet
To temporarily halt or (re-start) delivery of Technet send e-mail to [log in to unmask]: SET Technet NOMAIL or (MAIL)
To receive ONE mailing per day of all the posts: send e-mail to [log in to unmask]: SET Technet Digest
Search the archives of previous posts at: http://listserv.ipc.org/archives
Please visit IPC web site http://www.ipc.org/contentpage.asp?Pageid=4.3.16 for additional information, or contact Keach Sasamori at [log in to unmask] or 847-615-7100 ext.2815
-----------------------------------------------------

ATOM RSS1 RSS2