Some newer immersion silvers are organometallics....loaded with organic
materials. Since PTHs fill rapidly with solder could off-gassing of these
organics be contributors to the voids, especially if the immersion Ag is
very thick?
Best regards,
Leo
Director of Applications Engineering
ASAT, Inc.
3755 Capital of Texas Highway, Suite 100
Austin, Texas 78704
ph 512-383-4593
fx 512-383-1590
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www.asat.com
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-----Original Message-----
From: TechNet [mailto:[log in to unmask]]On Behalf Of Victor G. Hernandez
Sent: Tuesday, May 24, 2005 3:52 PM
To: [log in to unmask]
Subject: Re: [TN] Solder Joint Anomaly
Voiding was observed in solder joint when immersion silver was very
thick.
Victor,
-----Original Message-----
From: TechNet [mailto:[log in to unmask]] On Behalf Of
[log in to unmask]
Sent: Tuesday, May 24, 2005 3:28 PM
To: [log in to unmask]
Subject: Re: [TN] Solder Joint Anomaly
Al -
Surface finish is immersion silver? By any chance is this also a lead
free assembly?
Bruce Tostevin
Benchmark Electronics
Hudson, NH
-----Original Message-----
From: TechNet [mailto:[log in to unmask]] On Behalf Of Al Onderick
Sent: Tuesday, May 24, 2005 3:44 PM
To: [log in to unmask]
Subject: [TN] Solder Joint Anomaly
Dear Technetters,
I now have a couple of cross sections to go along with my
xrays.
Does anyone have an idea what might cause this type of anomaly?
http://www.texas-gold.org/PCB/pages/xray/index.htm
Is this a problem or just a strange looking void ?
The board supplier is going to run the following tests
* Cross section the 15 pin connector area for optical
microscopy and analysis.
* Scanning Electron Microscopy (SEM) analysis of
solder
filled and bare silver hole wall surfaces
o SEM will identify particulate or other 3-dimensional
bodies to be analyzed with EDS.
* Energy Dispersive Spectometry (EDS) analysis of
solder filled and bare silver hole wall surfaces
o EDS will identify the all elements relative to the
point of failure to identify possible contributors as the root cause.
* X-Ray Fluorescence of bare silver hole wall
surfaces
o XRF will determine the thickness of the solder
deposit
in the hole walls in the 15 pin connector area.
-Al
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