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May 2005

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Subject:
From:
Al Onderick <[log in to unmask]>
Reply To:
TechNet E-Mail Forum <[log in to unmask]>, [log in to unmask]
Date:
Tue, 24 May 2005 15:29:31 -0500
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text/plain
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Hi Werner,
        Thanyou for the response. The cross sections are a test board, for
the anomaly seen in the xrays.

Do you have an idea what causes the voiding in the Xrays.

Is it a reliability problem ?

-Al Onderick

-----Original Message-----
From: [log in to unmask] [mailto:[log in to unmask]] On Behalf Of
[log in to unmask]
Sent: Tuesday, May 24, 2005 3:08 PM
To: [log in to unmask]
Subject: Re: [TN] Solder Joint Anomaly

Hi All,
This is why people tent or fill their vias with soft polymer. These voids
create stress risers at the Cu barrel walls--not a real problem for benign
operating environments, but the death knell in severe conditions.



Regards,
Werner Engelmaier
Engelmaier Associates, L.C.
Electronic Packaging, Interconnection and Reliability Consulting
7 Jasmine Run
Ormond Beach, FL 32174 USA
Phone: 386-437-8747, Fax: 386-437-8737, Cell: 386-316-5904
E-mail: [log in to unmask], Website: www.engelmaier.com

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