TECHNET Archives

May 2005

TechNet@IPC.ORG

Options: Use Monospaced Font
Show Text Part by Default
Show All Mail Headers

Message: [<< First] [< Prev] [Next >] [Last >>]
Topic: [<< First] [< Prev] [Next >] [Last >>]
Author: [<< First] [< Prev] [Next >] [Last >>]

Print Reply
Subject:
From:
Reply To:
TechNet E-Mail Forum <[log in to unmask]>, [log in to unmask]
Date:
Tue, 24 May 2005 16:28:08 -0400
Content-Type:
text/plain
Parts/Attachments:
text/plain (96 lines)
Al -

Surface finish is immersion silver?  By any chance is this also a lead
free assembly?

Bruce Tostevin
Benchmark Electronics
Hudson, NH



-----Original Message-----
From: TechNet [mailto:[log in to unmask]] On Behalf Of Al Onderick
Sent: Tuesday, May 24, 2005 3:44 PM
To: [log in to unmask]
Subject: [TN] Solder Joint Anomaly

Dear Technetters,

            I now have a couple of cross sections to go along with my
xrays.



Does anyone have an idea what might cause this type of anomaly?




http://www.texas-gold.org/PCB/pages/xray/index.htm



Is this a problem or just a strange looking void ?



The board supplier is going to run the following tests



*                    Cross section the 15 pin connector area for optical
microscopy and analysis.

*                    Scanning Electron Microscopy (SEM) analysis of
solder
filled and bare silver hole wall surfaces

o                  SEM will identify particulate or other 3-dimensional
bodies to be analyzed with EDS.

*                    Energy Dispersive Spectometry (EDS) analysis of
solder filled and bare silver hole wall surfaces

o                  EDS will identify the all elements relative to the
point of failure to identify possible contributors as the root cause.

*                    X-Ray Fluorescence of bare silver hole wall
surfaces

o                  XRF will determine the thickness of the solder
deposit
in the hole walls in the 15 pin connector area.



-Al


---------------------------------------------------
Technet Mail List provided as a service by IPC using LISTSERV 1.8e
To unsubscribe, send a message to [log in to unmask] with following text
in
the BODY (NOT the subject field): SIGNOFF Technet
To temporarily halt or (re-start) delivery of Technet send e-mail to
[log in to unmask]: SET Technet NOMAIL or (MAIL)
To receive ONE mailing per day of all the posts: send e-mail to
[log in to unmask]: SET Technet Digest
Search the archives of previous posts at:
http://listserv.ipc.org/archives
Please visit IPC web site
http://www.ipc.org/contentpage.asp?Pageid=4.3.16 for additional
information, or contact Keach Sasamori at [log in to unmask] or 847-615-7100
ext.2815
-----------------------------------------------------

---------------------------------------------------
Technet Mail List provided as a service by IPC using LISTSERV 1.8e
To unsubscribe, send a message to [log in to unmask] with following text in
the BODY (NOT the subject field): SIGNOFF Technet
To temporarily halt or (re-start) delivery of Technet send e-mail to [log in to unmask]: SET Technet NOMAIL or (MAIL)
To receive ONE mailing per day of all the posts: send e-mail to [log in to unmask]: SET Technet Digest
Search the archives of previous posts at: http://listserv.ipc.org/archives
Please visit IPC web site http://www.ipc.org/contentpage.asp?Pageid=4.3.16 for additional information, or contact Keach Sasamori at [log in to unmask] or 847-615-7100 ext.2815
-----------------------------------------------------

ATOM RSS1 RSS2