TECHNET Archives

May 2005

TechNet@IPC.ORG

Options: Use Monospaced Font
Show Text Part by Default
Show All Mail Headers

Message: [<< First] [< Prev] [Next >] [Last >>]
Topic: [<< First] [< Prev] [Next >] [Last >>]
Author: [<< First] [< Prev] [Next >] [Last >>]

Print Reply
Subject:
From:
liusunny <[log in to unmask]>
Reply To:
TechNet E-Mail Forum <[log in to unmask]>, liusunny <[log in to unmask]>
Date:
Tue, 24 May 2005 14:25:48 +0800
Content-Type:
text/plain
Parts/Attachments:
text/plain (239 lines)
Kerry:
       So many reasons will cause this problem, but firs I think we should understand your question clearly.
1,  Can you asure it is the solder joint problem? As the pth of the board, the pth of the BGA substrate will also cause this problem.
2,  Can you asure it is a circult problem, or maybe it is only signal problem,  as Leo asked, which method are you used to define the intermittents?
3,  Which stage are you meeting this problem? After reflow, or after wave soldering, or aging, or testing ,or field failure?
4, How much failures are you meeting?
5,  Did another other component failured in this board?
6,  How many solder joints failure of this component?  Do these failure joints same in other boards?
7,  Have finished the Cross section and dye penetration ? What did you find?

      Hope you can find the real reason!

Regards!

Sunny
************************************************************
  Dr. Liu Sang
  Process Technology Section of Manufacture Technologies Center
  Huawei Technologies Company, LTD.
  Bantian, Longgang,
  Shenzhen 518129 P.R.China
  Tel:  (86)-755-89651102, Fax: (86)-755-89651064
  E-mail: [log in to unmask]
  http://www.huawei.com
 ************************************************************
This e-mail and its attachments contain confidential information from HUAWEI, which is intended only for the person or entity whose address is listed above. Any use of the information contained herein in any way (including, but not limited to, total or partial disclosure, reproduction, or dissemination) by persons other than the intended recipient(s) is prohibited. If you receive this e-mail in error, please notify the sender by phone or email immediately and delete it!
*****************************************************************
----- Original Message -----
From: "Kerry McMullen" <[log in to unmask]>
To: <[log in to unmask]>
Sent: Tuesday, May 24, 2005 2:00 AM
Subject: Re: [TN] BGA Intermittents


> Hi Paul,
> I am going to check now.  We have not had the problem before.
>
> Kerry
>
>
> Kerry McMullen
> Principal New Product Mfg. Engineer
> LTX Corporation
> 50 Rosemont Road
> Westwood, MA 02090-2306
> (T) 781-467-5468
>
>
>
> Paul Edwards <[log in to unmask]>
> 05/23/2005 01:40 PM
>
> To
> TechNet E-Mail Forum <[log in to unmask]>, [log in to unmask]
> cc
>
> Subject
> RE: [TN] BGA Intermittents
>
>
>
>
>
>
> Kerry,
>
> What size are the BGA pads and balls?
>
> Paul Edwards
> Process Engineering
> [log in to unmask]
> Tel: 408-433-4700
> FAX: 408-433-9988
> Surface Art Engineering
> 81Bonaventura Dr.
> San Jose, CA 95134
> DUNS: 944740570
> CAGE/NCAGE: 1XZ48
>
> -----Original Message-----
> From: Kerry McMullen [mailto:[log in to unmask]]
> Sent: Monday, May 23, 2005 10:31 AM
> To: [log in to unmask]
> Subject: Re: [TN] BGA Intermittents
>
> Hi Technetters,
> Typing too fast.
> Balls are 63/37.  Ball temperature near the middle balls measured by
> thermocouple is 206 Degrres C.  I do not want to go any higher as I might
> damage some of the other components on the board.  The board is 12" x 12"
> double sided.    I'm not sure if the design engineers are creating a fire
> drill here, or not.   First they say its the middle.  Today it is the
> corners.  The boards pass x-ray (non-oblique).    The boards have not
> warped at all.  Very balanced board both in layer thickness and Cu
> dispersion.    The only thing I have not found is the surface finish on
> the BGA substrate.
> I doubt it is the profile.....
>
> Thanks in advance for your help.
> Kerry
>
>
>
>
>
> Bev Christian <[log in to unmask]>
> Sent by: TechNet <[log in to unmask]>
> 05/23/2005 01:21 PM
> Please respond to
> TechNet E-Mail Forum <[log in to unmask]>; Please respond to
> Bev Christian <[log in to unmask]>
>
>
> To
> [log in to unmask]
> cc
>
> Subject
> Re: [TN] BGA Intermittents
>
>
>
>
>
>
> Kerry,
> Pure tin balls?!  I have not heard of that before.  Pure tin melts
> considerably higher than SAC alloys.  Hmm, 206C you say, 14 layer board?
> It is quite possible that your temperature/time is not enough to get a
> significant amount of diffusional mixing of the solder paste and the
> balls. But then you mention intermittents at the corners as well as the
> center.
>
> Two other possibilities are warping of the part (but would expect that to
> give you intermittents in one or the other area, not both) or there is a
> severe problem with the construction of the component itself and there is
> internal damage to the component.
>
> You don't say, but I presume the board itself solders well and there are
> no other soldering problems on the board that would lead you to suspect
> the solder paste?
> Bev
> RIM
>
> -----Original Message-----
> From: TechNet [mailto:[log in to unmask]]On Behalf Of Kerry McMullen
> Sent: May 23, 2005 1:10 PM
> To: [log in to unmask]
> Subject: [TN] BGA Intermittents
>
>
> Hi Technetters,
> I have a 1089 BGA with Sn balls.
> Paste is 63/37 SnPb
> Board is 14 layer,  .098 thick Immersion Ag.
> Ran thermocouples.  Inner balls are seeing 206 degrees C.
>
> What could be causing intermittents at the center and corners of the BGA?
>
> Thanks,
>
> ---------------------------------------------------
> Technet Mail List provided as a service by IPC using LISTSERV 1.8e
> To unsubscribe, send a message to [log in to unmask] with following text in
> the BODY (NOT the subject field): SIGNOFF Technet
> To temporarily halt or (re-start) delivery of Technet send e-mail to
> [log in to unmask]: SET Technet NOMAIL or (MAIL)
> To receive ONE mailing per day of all the posts: send e-mail to
> [log in to unmask]: SET Technet Digest
> Search the archives of previous posts at: http://listserv.ipc.org/archives
> Please visit IPC web site http://www.ipc.org/contentpage.asp?Pageid=4.3.16
> for additional information, or contact Keach Sasamori at [log in to unmask] or
> 847-615-7100 ext.2815
> -----------------------------------------------------
> Kerry
>
>
>
> ---------------------------------------------------------------------
> This transmission (including any attachments) may contain confidential
> information, privileged material (including material protected by the
> solicitor-client or other applicable privileges), or constitute non-public
> information. Any use of this information by anyone other than the intended
> recipient is prohibited. If you have received this transmission in error,
> please immediately reply to the sender and delete this information from
> your system. Use, dissemination, distribution, or reproduction of this
> transmission by unintended recipients is not authorized and may be
> unlawful.
>
> ---------------------------------------------------
> Technet Mail List provided as a service by IPC using LISTSERV 1.8e
> To unsubscribe, send a message to [log in to unmask] with following text in
> the BODY (NOT the subject field): SIGNOFF Technet
> To temporarily halt or (re-start) delivery of Technet send e-mail to
> [log in to unmask]: SET Technet NOMAIL or (MAIL)
> To receive ONE mailing per day of all the posts: send e-mail to
> [log in to unmask]: SET Technet Digest
> Search the archives of previous posts at: http://listserv.ipc.org/archives
> Please visit IPC web site http://www.ipc.org/contentpage.asp?Pageid=4.3.16
> for additional information, or contact Keach Sasamori at [log in to unmask] or
> 847-615-7100 ext.2815
> -----------------------------------------------------
>
>
> ---------------------------------------------------
> Technet Mail List provided as a service by IPC using LISTSERV 1.8e
> To unsubscribe, send a message to [log in to unmask] with following text in
> the BODY (NOT the subject field): SIGNOFF Technet
> To temporarily halt or (re-start) delivery of Technet send e-mail to
> [log in to unmask]: SET Technet NOMAIL or (MAIL)
> To receive ONE mailing per day of all the posts: send e-mail to
> [log in to unmask]: SET Technet Digest
> Search the archives of previous posts at: http://listserv.ipc.org/archives
> Please visit IPC web site http://www.ipc.org/contentpage.asp?Pageid=4.3.16
> for additional information, or contact Keach Sasamori at [log in to unmask] or
> 847-615-7100 ext.2815
> -----------------------------------------------------
>
>
> ---------------------------------------------------
> Technet Mail List provided as a service by IPC using LISTSERV 1.8e
> To unsubscribe, send a message to [log in to unmask] with following text in
> the BODY (NOT the subject field): SIGNOFF Technet
> To temporarily halt or (re-start) delivery of Technet send e-mail to [log in to unmask]: SET Technet NOMAIL or (MAIL)
> To receive ONE mailing per day of all the posts: send e-mail to [log in to unmask]: SET Technet Digest
> Search the archives of previous posts at: http://listserv.ipc.org/archives
> Please visit IPC web site http://www.ipc.org/contentpage.asp?Pageid=4.3.16 for additional information, or contact Keach Sasamori at [log in to unmask] or 847-615-7100 ext.2815
> -----------------------------------------------------

---------------------------------------------------
Technet Mail List provided as a service by IPC using LISTSERV 1.8e
To unsubscribe, send a message to [log in to unmask] with following text in
the BODY (NOT the subject field): SIGNOFF Technet
To temporarily halt or (re-start) delivery of Technet send e-mail to [log in to unmask]: SET Technet NOMAIL or (MAIL)
To receive ONE mailing per day of all the posts: send e-mail to [log in to unmask]: SET Technet Digest
Search the archives of previous posts at: http://listserv.ipc.org/archives
Please visit IPC web site http://www.ipc.org/contentpage.asp?Pageid=4.3.16 for additional information, or contact Keach Sasamori at [log in to unmask] or 847-615-7100 ext.2815
-----------------------------------------------------

ATOM RSS1 RSS2