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May 2005

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Subject:
From:
"Wenger, George M." <[log in to unmask]>
Reply To:
TechNet E-Mail Forum <[log in to unmask]>, Wenger, George M.
Date:
Mon, 23 May 2005 13:19:01 -0400
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text/plain (59 lines)
Kerry,

What is the surface finish on the BGA package substrate?

Regards,
George
George M. Wenger
Reliability / FMA Engineer
Base Station and Subsystems Group
Andrew Corporation, 40 Technology Drive, Warren, NJ 07059 (908) 546-4531 [log in to unmask]


-----Original Message-----
From: TechNet [mailto:[log in to unmask]]On Behalf Of Kerry McMullen
Sent: Monday, May 23, 2005 1:10 PM
To: [log in to unmask]
Subject: [TN] BGA Intermittents


Hi Technetters,
I have a 1089 BGA with Sn balls.
Paste is 63/37 SnPb
Board is 14 layer,  .098 thick Immersion Ag.
Ran thermocouples.  Inner balls are seeing 206 degrees C.

What could be causing intermittents at the center and corners of the BGA?

Thanks,

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Kerry

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