TECHNET Archives

May 2005

TechNet@IPC.ORG
Options: Use Monospaced Font
Show Text Part by Default
Show All Mail Headers

Message: [<< First] [< Prev] [Next >] [Last >>]
Topic: [<< First] [< Prev] [Next >] [Last >>]
Author: [<< First] [< Prev] [Next >] [Last >>]

Print Reply
Subject:
Re: FW: Hal SnPb Tichness
From:
Susan Mansilla <[log in to unmask]>
Reply To:
TechNet E-Mail Forum <[log in to unmask]>, [log in to unmask]
Date:
Sat, 21 May 2005 09:21:55 EDT
Content-Type:
text/plain
Parts/Attachments:
text/plain (20 lines) 
Yusef
Based on a Solderability Round Robin done several years ago, IPC found that
there was no consistent relationship with SnPb thickness and  solderability.
Samples with thin solder performed very well over time and  others with
excessive solder did not perform well.  Therefore the thickness  requirement was
dropped and a functional solderability test was put into all  specs and standards.

Susan Mansilla
Robisan Lab

---------------------------------------------------
Technet Mail List provided as a service by IPC using LISTSERV 1.8e
To unsubscribe, send a message to [log in to unmask] with following text in
the BODY (NOT the subject field): SIGNOFF Technet
To temporarily halt or (re-start) delivery of Technet send e-mail to [log in to unmask]: SET Technet NOMAIL or (MAIL)
To receive ONE mailing per day of all the posts: send e-mail to [log in to unmask]: SET Technet Digest
Search the archives of previous posts at: http://listserv.ipc.org/archives
Please visit IPC web site http://www.ipc.org/contentpage.asp?Pageid=4.3.16 for additional information, or contact Keach Sasamori at [log in to unmask] or 847-615-7100 ext.2815
-----------------------------------------------------

ATOM RSS1 RSS2