Solder Joint Reliability: Fundamentals in Solder Joint Reliability
Instructor: Werner Engelmaier
June 20, 2005 - San Jose, CA
June 23, 2005 - Austin, TX
Adequate reliability of surface mount solder attachments can only be assured with a 'Design for Reliability' based on solder joint behavior and the underlying fatigue damage mechanisms. Processing consistency and the quality of the resulting electronic assemblies, while of course necessary, are not the only parameters of reliability. Field use environment, product design life and the acceptable failure risk level must be considered. This course will address the issues of quality, manufacturability, and reliability.
Attendees will get hands-on experience in the above concepts through numerical examples. Attendees will be able to estimate the reliability of solder attachments and optimize the assembly design to achieve adequate reliability in their electronic assemblies.
Solder Joint Reliability: Failure Mode and Root Cause Analysis (Fatigue, Brittle Fracture ENIG)
Instructor: Werner Engelmaier
June 20, 2005 - San Jose, CA
June 23, 2005 - Austin, TX
Adequate reliability of surface mount solder attachments can only be assured with a 'Design for Reliability' based on solder joint behavior and the underlying fatigue damage mechanisms as discussed in the morning session. Processing consistency and the quality of the resulting electronic assemblies is, of course, also necessary to assure reliability.
Attendees will learn how to determine the root cause(s) and damage mechanism(s) underlying the solder joint failures of packages and will be able to optimize the assembly design and processes to achieve adequate reliability of their electronic assemblies. In this course quality, manufacturability, and reliability are discussed.
Solder Joint Reliability: Acceleration Models, Accelerated Reliability Tests and Screening Procedures
Instructor: Werner Engelmaier
June 21, 2005 - San Jose, CA
June 24, 2005 - Austin, TX
Adequate reliability of surface mount solder attachments can only be assured if a 'Design for Reliability-(DfR) based on solder joint behavior and the underlying fatigue damage mechanisms has been employed and when appropriate processing produces electronic assemblies of consistently high quality. Reliability design must take into account the field use environment, product design life and the acceptable failure risk level.
This understanding leads to the development of appropriate DfR procedures which come from properly executed accelerated reliability tests. In this course, quality, manufacturability, and reliability are discussed.
Solder Joint Reliability Issues for Lead Free Soldering
Instructor: Werner Engelmaier
June 21, 2005 - San Jose, CA
June 24, 2005 - Austin, TX
The impending switch to lead free (LF) solder raises issues on the manufacture, processing, and reliability of lead free electronic products. Adequate reliability of surface mount solder attachments can only be assured with a 'Design for Reliability' based on solder joint behavior and the underlying fatigue damage mechanisms. Processing consistency and the quality of the resulting electronic assemblies while, of course necessary, are not the only parameters of reliability.
The physics-of-failure and failure statistics underlying Sn/Pb solders in industry documents took over 30 years to develop. The available information for creep-fatigue behavior in LF-solders is inadequate to determine the acceleration factors and to develop creep-fatigue models.
For a full course description and pricing information please visit www.ipc.org/events or e-mail [log in to unmask]
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