It's not feasible to achieve .0003" minimum on large
discretes without high solder in fine pitch lands. A
realistic general range is .00005" to .001. So shelf life
and storage conditions should be a concern. Achieving a
tighter range is often achieved but it depends on the
specific design.

Thank you,
Eddie Rocha
South Bay Circuits


Yusuf,

for the min, a value that I picked from this forum is
0.0003", less than that and the Cu starts difusing through.
The max depends on the PCB. For a board with fine pitch,
0402, resistor networks and other dificult parts (which
should not be HASL anyways), the max deposit should not
exceed 0.001", or you start having serious problems
avoiding shorts. If your board has big components and the
smaller pitch is 0.050", you don't really have to specify a
maximum.

Ioan

> -----Original Message-----
> From: TechNet [SMTP:[log in to unmask]] On Behalf Of Baski
Devre
> Sent: Friday, May 20, 2005 10:22 AM
> To:   [log in to unmask]
> Subject:      [TN] HAL TIN THICKNESS
>
> Dear Technetters
> Is there any standard or range that specify the tin
thickness subjected to
> HAL(Hot air levelling) plating. What are the lower and
 top limit for the
> thickness of tin applied the HAL. What is the
appropriate, lower and the
> highst tin tickness for HAL
> Best regards
>
> Yusuf GOMEC
> Product Quality Engineer
>
>
> BASKI DEVRE SAN. ve TIC. LTD. STI.
> Ceyhan Sk. No:10 81490 Pendik-Istanbul-Turkey
> Tel:0090 216 3901036(4 Line)/4836560(4 Line)
> Fax:0090 216 3544941/4913269
> Gsm:0090 533 6579897/7480014
> Internet: www.baskidevre.com.tr
>
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