What is the standard thickness for electrolytic gold plate on BGA pads?
My customer's print is calling out .000030" minimum per MIL-G-45204 type
C class 1 over nickel plate .000150" per QQ-N-290 class 1 type 7. I have
misplaced my mil specs and do not remember the classes and types. Can
someone translate please? I am thinking that is too much gold for
surface mount soldering. Wouldn't the joint be dull and brittle?
Judy
-----Original Message-----
From: TechNet [mailto:[log in to unmask]] On Behalf Of R Sedlak
Sent: Tuesday, May 03, 2005 5:39 PM
To: [log in to unmask]
Subject: Re: [TN] minimum nickel thickness`
Phil:
Are you talking electroless or electrolytic Nickel? I believe
electroless to be MUCH more robust, and less pore prone. I would want
50% more electrolytic than electroless for the same protection, but even
this 50% factor can vary dramatically depending on plating rate.
Other question is this for simply surface mount, or, what other places
will it be done on the PCB? Will the board have tabs, and be inserted
and removed frequently?
So, as in many situations, the best answer probably is, "It depends".
Rudy Sedlak
RD Chemical Company
"Crepeau, Phil (Space Technology)" <[log in to unmask]> wrote:
hi,
forgetting about ipc spec requirements, what is the minimum nickel
plating thickness over copper on a printed wiring board that you would
feel comfortable with as a barrier against copper migration.
thanks,
phil
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