Yusuf,

for the min, a value that I picked from this forum is 0.0003", less than that and the Cu starts difusing through. The max depends on the PCB. For a board with fine pitch, 0402, resistor networks and other dificult parts (which should not be HASL anyways), the max deposit should not exceed 0.001", or you start having serious problems avoiding shorts. If your board has big components and the smaller pitch is 0.050", you don't really have to specify a maximum.

Ioan

> -----Original Message-----
> From: TechNet [SMTP:[log in to unmask]] On Behalf Of Baski Devre
> Sent: Friday, May 20, 2005 10:22 AM
> To:   [log in to unmask]
> Subject:      [TN] HAL TIN THICKNESS
> 
> Dear Technetters
> Is there any standard or range that specify the tin thickness subjected to
> HAL(Hot air levelling) plating. What are the lower and  top limit for the
> thickness of tin applied the HAL. What is the appropriate, lower and the
> highst tin tickness for HAL
> Best regards
> 
> Yusuf GOMEC
> Product Quality Engineer
> 
> 
> BASKI DEVRE SAN. ve TIC. LTD. STI.
> Ceyhan Sk. No:10 81490 Pendik-Istanbul-Turkey
> Tel:0090 216 3901036(4 Line)/4836560(4 Line)
> Fax:0090 216 3544941/4913269
> Gsm:0090 533 6579897/7480014
> Internet: www.baskidevre.com.tr
> 
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