TECHNET Archives

May 2005

TechNet@IPC.ORG

Options: Use Monospaced Font
Show Text Part by Default
Show All Mail Headers

Message: [<< First] [< Prev] [Next >] [Last >>]
Topic: [<< First] [< Prev] [Next >] [Last >>]
Author: [<< First] [< Prev] [Next >] [Last >>]

Print Reply
Subject:
From:
Baski Devre <[log in to unmask]>
Reply To:
TechNet E-Mail Forum <[log in to unmask]>, Baski Devre <[log in to unmask]>
Date:
Fri, 20 May 2005 17:33:07 +0300
Content-Type:
text/plain
Parts/Attachments:
text/plain (28 lines)
Dear Technetters
Is there any standard or range that specify the tin thickness subjected to
HAL(Hot air levelling) plating. What are the lower and  top limit for the
thickness of tin applied the HAL. What is the appropriate, lower and the
highest tin thickness for HAL
Best regards

Yusuf GOMEC
Product Quality Engineer


BASKI DEVRE SAN. ve TIC. LTD. STI.
Ceyhan Sk. No:10 81490 Pendik-Istanbul-Turkey
Tel:0090 216 3901036(4 Line)/4836560(4 Line)
Fax:0090 216 3544941/4913269
Gsm:0090 533 6579897/7480014
Internet: www.baskidevre.com.tr

---------------------------------------------------
Technet Mail List provided as a service by IPC using LISTSERV 1.8e
To unsubscribe, send a message to [log in to unmask] with following text in
the BODY (NOT the subject field): SIGNOFF Technet
To temporarily halt or (re-start) delivery of Technet send e-mail to [log in to unmask]: SET Technet NOMAIL or (MAIL)
To receive ONE mailing per day of all the posts: send e-mail to [log in to unmask]: SET Technet Digest
Search the archives of previous posts at: http://listserv.ipc.org/archives
Please visit IPC web site http://www.ipc.org/contentpage.asp?Pageid=4.3.16 for additional information, or contact Keach Sasamori at [log in to unmask] or 847-615-7100 ext.2815
-----------------------------------------------------

ATOM RSS1 RSS2