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May 2005

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Subject:
Re: Semi q about power zeners
From:
Joyce Koo <[log in to unmask]>
Reply To:
[log in to unmask]
Date:
Fri, 20 May 2005 09:53:25 -0400
Content-Type:
text/plain
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text/plain (53 lines) 
1-2 micron ring a bell.
                             jk

-----Original Message-----
From: TechNet [mailto:[log in to unmask]]On Behalf Of Ingemar Hernefjord
(KC/EMW)
Sent: Friday, May 20, 2005 9:38 AM
To: [log in to unmask]
Subject: [TN] Semi q about power zeners


Not exactly a PWB matter, but I know about the width of knowhow in this
society. So, here we go:
bolted zener, 1200 A us capability. Chip is soldered on copper stud, upside
of chip is soldered to a 1 mm thick pin. The end of this pin is bent and
flat. Now, all know that itīs important to spread the instant current as
fast and evenly as possible throughout the chip area, and without voids in
the solder joint. If this isn't fulfilled, you may get metal filaments into
the chip and then a channel burnt through the die. Now comes the question:
anyone with experience from front metallisation thickness on such high power
dies? In my opinion, the metallisation ought to be several micrometers, but
we have a case with just some 200 nanometers. The wafer makers do not give
clear answer, or no answer at all. Well reputed IRC got some 100 technical
papers, many of which are very advanced...but not one line about the front
metal vs. current.
Anny Sir Yeastchon?
Ingemar Hernefjord
Ericsson Microwave Systems

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