TECHNET Archives

May 2005

TechNet@IPC.ORG

Options: Use Monospaced Font
Show Text Part by Default
Show All Mail Headers

Message: [<< First] [< Prev] [Next >] [Last >>]
Topic: [<< First] [< Prev] [Next >] [Last >>]
Author: [<< First] [< Prev] [Next >] [Last >>]

Print Reply
Subject:
From:
"Dehoyos, Ramon" <[log in to unmask]>
Reply To:
TechNet E-Mail Forum <[log in to unmask]>, Dehoyos, Ramon
Date:
Thu, 19 May 2005 10:50:55 -0400
Content-Type:
text/plain
Parts/Attachments:
text/plain (51 lines)
        Hi Charlie:
                        The glass has to be of the same mass as the real part. If it is less of a mass it will not portray the real device. It still is a good idea. How about this way, place kapton tape over the BGA pattern on the board, obtain BGA copper pattern form vendor and place it over the tape, paste the pattern, place the BGA over it and reflow it.  Clean board, pull BGA off the board and inspect. You might have to peel off the copper traces to view the solder balls.
        Regards,
        Ramon

-----Original Message-----
From: TechNet [mailto:[log in to unmask]]On Behalf Of Charlie Pitarys
Sent: Thursday, May 19, 2005 10:29 AM
To: [log in to unmask]
Subject: [TN] BGA test coupon


Hello all, In pursuit of better cleaning I am looking for a supplier or
creative inventor that has a BGA style device/component (pick a size)
where the top is clear and you can look through and see if any flux
residue remains around the bump pattern.
My method currently employs heating up the substrate and popping off the
die,etc. The heat can skew the visual data by reheating and/or
volatilize any flux remaining etc. Plus if you have had too much coffee
during the day this exercise can get a little dicey!

I don't want to invest 30K for a spy scope either.
I know about the glass slide deal for cleaning and I am not a big fan of
it. 20+ yrs in this biz and this test method is too labor intensive and
is only designed to fail IMHO.

TIA

Charlie Pitarys
603.622.2900 x-115

---------------------------------------------------
Technet Mail List provided as a service by IPC using LISTSERV 1.8e
To unsubscribe, send a message to [log in to unmask] with following text in
the BODY (NOT the subject field): SIGNOFF Technet
To temporarily halt or (re-start) delivery of Technet send e-mail to [log in to unmask]: SET Technet NOMAIL or (MAIL)
To receive ONE mailing per day of all the posts: send e-mail to [log in to unmask]: SET Technet Digest
Search the archives of previous posts at: http://listserv.ipc.org/archives
Please visit IPC web site http://www.ipc.org/contentpage.asp?Pageid=4.3.16 for additional information, or contact Keach Sasamori at [log in to unmask] or 847-615-7100 ext.2815
-----------------------------------------------------

---------------------------------------------------
Technet Mail List provided as a service by IPC using LISTSERV 1.8e
To unsubscribe, send a message to [log in to unmask] with following text in
the BODY (NOT the subject field): SIGNOFF Technet
To temporarily halt or (re-start) delivery of Technet send e-mail to [log in to unmask]: SET Technet NOMAIL or (MAIL)
To receive ONE mailing per day of all the posts: send e-mail to [log in to unmask]: SET Technet Digest
Search the archives of previous posts at: http://listserv.ipc.org/archives
Please visit IPC web site http://www.ipc.org/contentpage.asp?Pageid=4.3.16 for additional information, or contact Keach Sasamori at [log in to unmask] or 847-615-7100 ext.2815
-----------------------------------------------------

ATOM RSS1 RSS2