We have a couple engineers who are insisting on using Via in (SMT) pad. I'm not talking about micro via in a BGA pad. I'm talking about vias with a 10 to 28 mil hole in a 0805, PLCC, QFP, and other SMT pad.
In order for this to work in manufacturing they must be filled, without voids, and capped flush on the solder surface.
Does anyone know of a board house that does this process?

Would you have an idea what the general cost effect to a board for this process and does it make a difference if it's one via or 500 vias? Cost difference between electrically conductive and thermally conductive fill?
 
Any information would be helpful,
 
 
Allen Maddox C.I.D.
Sr. PC Board Designer
GAI-Tronics, Corp
610-796-5854
PO Box 1060
Reading, PA 19607-1060
 
[log in to unmask]
www.gai-tronics.com


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