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May 2005

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Subject:
From:
Eddie Rocha <[log in to unmask]>
Reply To:
TechNet E-Mail Forum <[log in to unmask]>, Eddie Rocha <[log in to unmask]>
Date:
Tue, 17 May 2005 14:28:55 -0700
Content-Type:
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Selective solder stripping could get you a tin-lead finish
with SMOBC.

Thank you,
Eddie Rocha
South Bay Circuits


This may seem like a strange question, but here it is:

Can a board have a tin/lead finish on the solderable
surfaces when
SMOBC is called out, and comply with a note on the drawing
that
SPECIFICALLY states that HASL is not allowed?

I have a fab vendor that's telling me that it's not
possible. SMOBC without
HASL can't happen, if you want a tin/lead finish on the
pads...is that
true?

I've been told that there will be some areas that will
wind-up having a
tin/lead
finish beneath the soldermask, which we all know isn't a
good thing because
of the loss of adhesion of the mask when the assembly goes
thru reflow or
wave solder.

Kind regards,

-Steve Gregory-
Senior Process Engineer
LaBarge Incorporated
Tulsa, Oklahoma
(918) 459-2285
(918) 459-2350 FAX
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