TECHNET Archives

May 2005

TechNet@IPC.ORG

Options: Use Monospaced Font
Show Text Part by Default
Show All Mail Headers

Message: [<< First] [< Prev] [Next >] [Last >>]
Topic: [<< First] [< Prev] [Next >] [Last >>]
Author: [<< First] [< Prev] [Next >] [Last >>]

Print Reply
Subject:
From:
Al Onderick <[log in to unmask]>
Reply To:
TechNet E-Mail Forum <[log in to unmask]>, [log in to unmask]
Date:
Wed, 4 May 2005 09:06:07 -0500
Content-Type:
text/plain
Parts/Attachments:
text/plain (87 lines)
Originally we thought they were silver. They are Immersion White Tin.
We've decided to scrap the whole lot.

-Al Onderick

-----Original Message-----
From: [log in to unmask] [mailto:[log in to unmask]] On Behalf Of [log in to unmask]
Sent: Wednesday, May 04, 2005 3:34 AM
To: [log in to unmask]
Subject: Re: [TN] Via contamination

Are these boards Immersion Tin? We had a similar problem with some Tin
PCB's
where the Tin chemistry was being left behind in the tented vias and then
erupting during reflow. Check with PCB supplier.

Mark

===== Original Message from [log in to unmask] (TechNet E-Mail Forum) at
3/05/05 16:40
>Greetings Tech netters,
>
>
>
>            In the past we've had problems with tented vias not
completely
>tenting and trapping liquid.  The liquid would boil and find its way to
>the surface of the board.
>
>
>
>While this looks similar these vias were not tented.
>
>
>
>
>
>http://www.texas-gold.org/PCB/
>
>
>
>Al Onderick
>
>National Instruments
>
>
>---------------------------------------------------
>Technet Mail List provided as a service by IPC using LISTSERV 1.8e
>To unsubscribe, send a message to [log in to unmask] with following text in
>the BODY (NOT the subject field): SIGNOFF Technet
>To temporarily halt or (re-start) delivery of Technet send e-mail to
>[log in to unmask]: SET Technet NOMAIL or (MAIL)
>To receive ONE mailing per day of all the posts: send e-mail to
>[log in to unmask]: SET Technet Digest
>Search the archives of previous posts at:
http://listserv.ipc.org/archives
>Please visit IPC web site
http://www.ipc.org/contentpage.asp?Pageid=4.3.16
>for additional information, or contact Keach Sasamori at [log in to unmask]
or
>847-615-7100 ext.2815
>-----------------------------------------------------

---------------------------------------------------
Technet Mail List provided as a service by IPC using LISTSERV 1.8e
To unsubscribe, send a message to [log in to unmask] with following text in
the BODY (NOT the subject field): SIGNOFF Technet
To temporarily halt or (re-start) delivery of Technet send e-mail to
[log in to unmask]: SET Technet NOMAIL or (MAIL)
To receive ONE mailing per day of all the posts: send e-mail to
[log in to unmask]: SET Technet Digest
Search the archives of previous posts at: http://listserv.ipc.org/archives
Please visit IPC web site http://www.ipc.org/contentpage.asp?Pageid=4.3.16
for additional information, or contact Keach Sasamori at [log in to unmask] or
847-615-7100 ext.2815
-----------------------------------------------------

---------------------------------------------------
Technet Mail List provided as a service by IPC using LISTSERV 1.8e
To unsubscribe, send a message to [log in to unmask] with following text in
the BODY (NOT the subject field): SIGNOFF Technet
To temporarily halt or (re-start) delivery of Technet send e-mail to [log in to unmask]: SET Technet NOMAIL or (MAIL)
To receive ONE mailing per day of all the posts: send e-mail to [log in to unmask]: SET Technet Digest
Search the archives of previous posts at: http://listserv.ipc.org/archives
Please visit IPC web site http://www.ipc.org/contentpage.asp?Pageid=4.3.16 for additional information, or contact Keach Sasamori at [log in to unmask] or 847-615-7100 ext.2815
-----------------------------------------------------

ATOM RSS1 RSS2