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May 2005

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Subject:
Solder Spheres
From:
David Tremmel <[log in to unmask]>
Reply To:
TechNet E-Mail Forum <[log in to unmask]>, David Tremmel <[log in to unmask]>
Date:
Fri, 13 May 2005 12:14:47 -0500
Content-Type:
text/plain
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text/plain (33 lines) 
Dear Technetters,

I have some BGAs which have the following comments in the Mechanical
Requirements section:

Leadframe Plating:  Copper base material with a 5-micron (200 micro-inches)
minimum of Tin/Lead overplating containing 10-40% lead.


Can one of the Enlightened Ones please help someone groping in the darkness?


As always, I appreciate the feedback I receive.


David Tremmel
Production Manager
Belmont Component Services

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