Phil:

Are you talking electroless or electrolytic Nickel?  I believe electroless to be MUCH more robust, and less pore prone.   I would want 50% more electrolytic than electroless for the same protection, but even this 50% factor can vary dramatically depending on plating rate.
Other question is this for simply surface mount, or, what other places will it be done on the PCB?   Will the board have tabs, and be inserted and removed frequently?

So, as in many situations, the best answer probably is, "It depends".

Rudy Sedlak
RD Chemical Company

"Crepeau, Phil (Space Technology)" <[log in to unmask]> wrote:
hi,

forgetting about ipc spec requirements, what is the minimum nickel plating thickness over copper on a printed wiring board that you would feel comfortable with as a barrier against copper migration.

thanks,

phil

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