Currently we are running a prototype on five boards. Three out of the
five are having problems with the snap off rails, the edge of the board
is routed with three mouse bites keeping the rail attached. When the
rail is removed it takes along with it solder mask and what appears to
be epoxy. (In one instance it lifted a trace off the PCB) My first
thought is that the epoxy or solder mask is under cured, my second is
that there is contamination under the solder mask preventing it from
adhering to the PCB. Has anyone come across a problem like this before?
If so what was the cause. Am I wrong in thinking that the laminate might
be under cured?

 

Thank you,

 

Ted Tontis CID

NPI Engineer

Creation Technologies Inc.

2250 West Southbranch Boulevard

Oak Creek, WI 53154

Phone 414-761-0400 x6530

Fax 414-761-0582

[log in to unmask]

www.creationtech.com <http://www.creationtech.com/> 

 

 

 


---------------------------------------------------
Technet Mail List provided as a service by IPC using LISTSERV 1.8e
To unsubscribe, send a message to [log in to unmask] with following text in
the BODY (NOT the subject field): SIGNOFF Technet
To temporarily halt or (re-start) delivery of Technet send e-mail to [log in to unmask]: SET Technet NOMAIL or (MAIL)
To receive ONE mailing per day of all the posts: send e-mail to [log in to unmask]: SET Technet Digest
Search the archives of previous posts at: http://listserv.ipc.org/archives
Please visit IPC web site http://www.ipc.org/contentpage.asp?Pageid=4.3.16 for additional information, or contact Keach Sasamori at [log in to unmask] or 847-615-7100 ext.2815
-----------------------------------------------------