Kerry - the Tg is only a very small part of the equation, T288 and Td are
more critical parameters. If you attempt to run a T288 on 406 it blows up
before it even reaches the Isotherm. If you run a T260 it might survive 2 to
4 minutes - not a lot of thermal fudge factor given the possibility of
multiple reflows and reworks. Isola, who manufactures the 406 does NOT
recommend this material for 260C reflow situations and have introduced the
410 as it's replacement. At Photocircuits Corporation, we are recommending
to our customers of either 406 or PCL370 to switch to IS410 or PCL370HR
respectively. As the old saying goes - you can make one of anything but for
a reliable material in the lead free assembly world forget the 406.

Gerard O'Brien
Dir. Of Material Test, Reliability and Technology

-----Original Message-----
From: Kerry McMullen [mailto:[log in to unmask]]
Sent: Wednesday, May 11, 2005 12:03 PM
To: [log in to unmask]
Subject: [TN] FR406 Tg 175 Degrees C - Lead Free Processing

Hi TechNetters

Can I use FR406 175 Degrees C laminate during a lead free assembly process
where the reflow temp will be around 260 Degrees C. ?
The boards will be ENIG.  Any disadvantages.

I know there was a thread, but I can't find it.

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