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May 2005

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Subject:
From:
Judy Brown <[log in to unmask]>
Reply To:
TechNet E-Mail Forum <[log in to unmask]>, Judy Brown <[log in to unmask]>
Date:
Wed, 11 May 2005 10:59:50 -0700
Content-Type:
text/plain
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text/plain (84 lines)
Technetters,
        Where can I find the requirements for the 0402 pad layout. I
have checked 7351 and cannot locate the criteria.

Judy Brown

-----Original Message-----
From: TechNet [mailto:[log in to unmask]] On Behalf Of Le Thanh Tung
Sent: Tuesday, May 10, 2005 5:39 PM
To: [log in to unmask]
Subject: Re: [TN] Tombstone

Following is one of reasons cause Tombstone:
    - Vertial shifted part: Mounting condition is NG
    - Not same solder paste volume at two sides of part: Printing
condition
is NG.
    - Temperature at two electrodes of part is different: when PCBA
going
through reflow machine, one electrode
       of part will be heated and smell first -- > tombstone
Best regard.

----- Original Message -----
From: "Suganthi" <[log in to unmask]>
To: <[log in to unmask]>
Sent: Tuesday, May 10, 2005 2:51 PM
Subject: [TN] Tombstone



Dear All,

What is called Tombstone effect ,please explain me , and tell me how to
overcome this problem..

Thanks and Regards

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Suganthi

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