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May 2005

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Subject:
From:
Jeffrey Bush <[log in to unmask]>
Reply To:
TechNet E-Mail Forum <[log in to unmask]>, Jeffrey Bush <[log in to unmask]>
Date:
Wed, 11 May 2005 13:15:41 -0400
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Degradation of FR406 begins ~ 230 C and will not withstand TC above this
very well.  I suggest trying this material as a control with an
experimental lot of a filled material like IS415 is you like Isola.  You
may find that FR408 works well for you application as well - it has a
higher Td than FR406 and is slightly more in cost.  Testing is the key
which should include some package analysis after the TC processes - DSC,
TMA, TGA, DMA, etc.

Jeffrey Bush
Director, Quality Assurance and Technical Support

VERMONT CIRCUITS INCORPORATED
  76 Technology Drive - POB 1890
    Brattleboro, Vermont 05302
      Voice: 802.257.4571.21 Fax: 802.257.0011
           http://www.vtcircuits.com
 

-----Original Message-----
From: Kerry McMullen [mailto:[log in to unmask]] 
Sent: Wednesday, May 11, 2005 1:03 PM
To: [log in to unmask]
Subject: [TN] FR406 Tg 175 Degrees C - Lead Free Processing

Hi TechNetters

Can I use FR406 175 Degrees C laminate during a lead free assembly
process
where the reflow temp will be around 260 Degrees C. ?
The boards will be ENIG.  Any disadvantages.

I know there was a thread, but I can't find it.

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