TECHNET Archives

May 2005

TechNet@IPC.ORG

Options: Use Monospaced Font
Show Text Part by Default
Show All Mail Headers

Message: [<< First] [< Prev] [Next >] [Last >>]
Topic: [<< First] [< Prev] [Next >] [Last >>]
Author: [<< First] [< Prev] [Next >] [Last >>]

Print Reply
Subject:
From:
Ryan Grant <[log in to unmask]>
Reply To:
TechNet E-Mail Forum <[log in to unmask]>, [log in to unmask]
Date:
Wed, 11 May 2005 08:39:33 -0600
Content-Type:
text/plain
Parts/Attachments:
text/plain (105 lines)
Hi Steve,

Myself, I would NOT accept ENIG under the solder mask.  If the board
shop doesn't have an LPI that can survive ENIG...well, that's a big red
flag!  For a second opinion, go ask your rework operators.  If this
board has BGA, then WHEN you rework (and you know you will), you will
pop off the soldermask web far more often with ENIG under the soldermask
than with SMOC.  

-Ryan

-----Original Message-----
From: TechNet [mailto:[log in to unmask]] On Behalf Of Stephen Gregory
Sent: Wednesday, May 11, 2005 7:33 AM
To: [log in to unmask]
Subject: [TN] LPI adhesion on ENIG vs. copper...

Mornin' all you 'Netters!

Gotta question. We're getting a board quoted to buy, and the shop has
come back for some relief on some notes on the drawing that state:

Process Notes:

1. Plate all exposed areas with Electroless Immersion Gold
Nickel 100 microinches thk., Gold 2-10 microinches thk. min.

2. Apply LPI soldermask over bare copper (SMOBC)
Color: Green
Conform to IPC-SM-840, Class H Current rev.
Resizing of soldermask pad clearances may be
required due to suppliers choice of material and/or
process. soldermask clearance for vias to be .004 larger than drill
hole.

The fab house is asking to plate the whole board with ENIG, and then
apply
the soldermask because they say that the ENIG process after applying the
LPI
will make the mask look ugly.

I know the ENIG process can be tough on soldermasks, but I thought that
problem
has already been worked out...

I gues my real question is; is the adhesion of LPI over ENIG any worse
or
better than
SMOBC?

My gut feel is to tell the fab house to comply with the notes on the
drawing, I really
don't want to ask our customer if the fab house can deviate from the
notes
on the
drawing. But on the other hand, I don't want to get a raggedy looking
board
from
them if they don't have their ENIG processes in control...

Kind regards,

-Steve Gregory-
Senior Process Engineer
LaBarge Incorporated
Tulsa, Oklahoma
(918) 459-2285
(918) 459-2350 FAX
__________________________________________________________________
This message may contain information that is privileged and confidential
to
LaBarge, Inc.  It is for use only by the individual or entity named
above.
If you are not the intended recipient, you may not copy, use or deliver
this message to anyone.  In such event, you should destroy the message
and
kindly notify the sender by reply e-mail.

---------------------------------------------------
Technet Mail List provided as a service by IPC using LISTSERV 1.8e
To unsubscribe, send a message to [log in to unmask] with following text
in
the BODY (NOT the subject field): SIGNOFF Technet
To temporarily halt or (re-start) delivery of Technet send e-mail to
[log in to unmask]: SET Technet NOMAIL or (MAIL)
To receive ONE mailing per day of all the posts: send e-mail to
[log in to unmask]: SET Technet Digest
Search the archives of previous posts at:
http://listserv.ipc.org/archives
Please visit IPC web site
http://www.ipc.org/contentpage.asp?Pageid=4.3.16 for additional
information, or contact Keach Sasamori at [log in to unmask] or 847-615-7100
ext.2815
-----------------------------------------------------

---------------------------------------------------
Technet Mail List provided as a service by IPC using LISTSERV 1.8e
To unsubscribe, send a message to [log in to unmask] with following text in
the BODY (NOT the subject field): SIGNOFF Technet
To temporarily halt or (re-start) delivery of Technet send e-mail to [log in to unmask]: SET Technet NOMAIL or (MAIL)
To receive ONE mailing per day of all the posts: send e-mail to [log in to unmask]: SET Technet Digest
Search the archives of previous posts at: http://listserv.ipc.org/archives
Please visit IPC web site http://www.ipc.org/contentpage.asp?Pageid=4.3.16 for additional information, or contact Keach Sasamori at [log in to unmask] or 847-615-7100 ext.2815
-----------------------------------------------------

ATOM RSS1 RSS2