TECHNET Archives

May 2005

TechNet@IPC.ORG

Options: Use Monospaced Font
Show Text Part by Default
Show All Mail Headers

Message: [<< First] [< Prev] [Next >] [Last >>]
Topic: [<< First] [< Prev] [Next >] [Last >>]
Author: [<< First] [< Prev] [Next >] [Last >>]

Print Reply
Subject:
From:
Roger Stoops <[log in to unmask]>
Reply To:
TechNet E-Mail Forum <[log in to unmask]>, Roger Stoops <[log in to unmask]>
Date:
Wed, 11 May 2005 10:12:44 -0400
Content-Type:
text/plain
Parts/Attachments:
text/plain (122 lines)
Bev,
  J-STD-020, section 1.1 states in part: "This classification procedure
applies to all nonhermetic solid state Surface Mount Devices (SMDs) in
packages, which, because of absorbed moisture, could be sensitive to
damage during solder reflow."
  But you make a good point... It would be great to have a similar
classification for PCBs so that, instead of telling the end user what
temps and conditions the raw materials are designed to meet, the end
user would know what to expect of and how the pcb fab *will* perform
during assembly, storage, and use conditions.
  ("It warped during Pb-free reflow? We used 170degC Tg material; it
shouldn't have done that... You have to ship the boards today you say?
Your *** is grass and your customer is the lawnmower?  Sorry to hear
that...")
  
Regards,
Roger

-----Original Message-----
From: Bev Christian [mailto:[log in to unmask]] 
Sent: Wednesday, May 11, 2005 9:59 AM
To: TechNet E-Mail Forum; Roger Stoops
Subject: RE: [TN] MSL?

Roger,
I am wondering if we can make your last statement so definitive.  During
the early 90's boards were not made as well as they are now and we did
have to bake them - from certain manufacturers.  I am wondering with the
higher temperatures for Pb-free soldering if we might see the problem
raise its ugly head for some of the lower end suppliers. I don't know,
I'm just asking.
Bev
RIM

-----Original Message-----
From: TechNet [mailto:[log in to unmask]] On Behalf Of Roger Stoops
Sent: May 11, 2005 9:52 AM
To: [log in to unmask]
Subject: Re: [TN] MSL?

MSL = Moisture Sensitivity Level, defines and characterizes how an
IC/xstr/dio/etc. package will withstand exposure to temperature and
humidity over time.  Specifically important for defining what process or
procedure to use in assembling semiconductors to a pcb.  The MSL level
has become more of an issue with RoHS due to the elevated reflow temps.
J-STD-020 describes this in more detail; the lower the number, the more
robust the part.  The Jedec std is free on the 'net.

Doesn't really pertain to PCBs.

Regards,
Roger

-----Original Message-----
From: TechNet [mailto:[log in to unmask]] On Behalf Of Eddie Rocha
Sent: Tuesday, May 10, 2005 6:23 PM
To: [log in to unmask]
Subject: [TN] MSL?

I'm a PCB fabricator, and I have a survey asking me several general
questions related to RoHS with one being moisture sensitivity level
(MSL)?  What exactly are they looking for? Does this pertain to bare
PCB's?

-- Thanks,
Eddie Rocha
South Bay Circuits
(480) 940-3125 x122

---------------------------------------------------
Technet Mail List provided as a service by IPC using LISTSERV 1.8e To
unsubscribe, send a message to [log in to unmask] with following text in
the BODY (NOT the subject field): SIGNOFF Technet To temporarily halt or
(re-start) delivery of Technet send e-mail to [log in to unmask]: SET
Technet NOMAIL or (MAIL) To receive ONE mailing per day of all the
posts: send e-mail to [log in to unmask]: SET Technet Digest Search the
archives of previous posts at: http://listserv.ipc.org/archives Please
visit IPC web site http://www.ipc.org/contentpage.asp?Pageid=4.3.16 for
additional information, or contact Keach Sasamori at [log in to unmask] or
847-615-7100 ext.2815
-----------------------------------------------------

---------------------------------------------------
Technet Mail List provided as a service by IPC using LISTSERV 1.8e To
unsubscribe, send a message to [log in to unmask] with following text in
the BODY (NOT the subject field): SIGNOFF Technet To temporarily halt or
(re-start) delivery of Technet send e-mail to
[log in to unmask]: SET Technet NOMAIL or (MAIL) To receive ONE mailing
per day of all the posts: send e-mail to
[log in to unmask]: SET Technet Digest
Search the archives of previous posts at:
http://listserv.ipc.org/archives
Please visit IPC web site
http://www.ipc.org/contentpage.asp?Pageid=4.3.16 for additional
information, or contact Keach Sasamori at [log in to unmask] or 847-615-7100
ext.2815
-----------------------------------------------------




---------------------------------------------------------------------
This transmission (including any attachments) may contain confidential
information, privileged material (including material protected by the
solicitor-client or other applicable privileges), or constitute
non-public information. Any use of this information by anyone other than
the intended recipient is prohibited. If you have received this
transmission in error, please immediately reply to the sender and delete
this information from your system. Use, dissemination, distribution, or
reproduction of this transmission by unintended recipients is not
authorized and may be unlawful.

---------------------------------------------------
Technet Mail List provided as a service by IPC using LISTSERV 1.8e
To unsubscribe, send a message to [log in to unmask] with following text in
the BODY (NOT the subject field): SIGNOFF Technet
To temporarily halt or (re-start) delivery of Technet send e-mail to [log in to unmask]: SET Technet NOMAIL or (MAIL)
To receive ONE mailing per day of all the posts: send e-mail to [log in to unmask]: SET Technet Digest
Search the archives of previous posts at: http://listserv.ipc.org/archives
Please visit IPC web site http://www.ipc.org/contentpage.asp?Pageid=4.3.16 for additional information, or contact Keach Sasamori at [log in to unmask] or 847-615-7100 ext.2815
-----------------------------------------------------

ATOM RSS1 RSS2