Certain masks are more susceptible to aggresive solutions (Enig i.e.)
attack. We currently use Enthone without this problem, the previous mask we
used years ago presented many similar problems such as aggressive solutions
attack.

If they are requesting this, and it will not present a problem during your
assembly and/or use then why not approve it? It would seem to me they
realize the limitations of their processes and this concession may be part
of it.

We process solder mask both over and under electroless and electrolytic gold
depending upon the product without any difference in adhesion
properties...where you may see adhesion problems in this case is if they
process a less durable solder mask through Enig...the attacked mask is
likely to fail.

Franklin

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